Thermally Conductive Silicone Interface Pad Mat Sheets,Silicone Interface Heat Transfer Pad Mat Sheets,Silicone Interface Pad Mat Sheets Cooler,Silicone Interface Cooling Pad Mat Sheets,Cooling Silicone Interface Pad,Silicone Interface Cooling Pad Mat Film Sheets
Product Features:
Thermal conductivity: 1.2W/m-K
Available in thickness from 0.020” – 0.200”
(0.5mm--5.0mm),0.010-inch(0.25mm) increments
Low compression set enables the pad to be reused
HWP-is a highly conformable, low modulus, low hardness filled-silicone polymer, at pressures of 50 psi, deflect 50% the original thickness, the material can be used as an interface where one side is in contact with a leaded device
Product Applications:
Telecommunication hardware
Memory modules
LED solid state lighting
Computer and peripherals
Power electronics
Automotive electronics
Handheld electronics
Graphics cards
Heat sink thermal model
Configurations Available and Options
Sheet form (18”X18”,18”X9”) and custom die-cut parts
A1 indicates only one side tacky
T1 indicates insulator liner option