Heat conduction and heat dissipation filling material Thermally Conductive Silicone Interface Pad Mat Sheets,Silicone Interface Heat Transfer Pad Mat Sheets,Silicone Interface Pad Mat Sheets Cooler,Silicone Interface Cooling Pad Mat Sheets,Cooling Silicone Interface Pad,thermally conductive interface silicone pad
Product Features:
-Good thermal conductivity
-High conformability and cost effective
-Shock absorbing and naturally tacky
-Electrically insulating
-it is easy to fill in air gaps between PC board and heat sinks or a metal chassis
Product Applications:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.